• Biyapay

      Tool Loadport Station(TLP)
      For non-vacuum environments housing wafers, a positive pressure and closed-loop control system are employed for purging, utilizing the fab's power system (N2/XCDA). For the first time in China, MeetFuture's TLP1.0 has significantly reduced the humidity of FOUP to below RH1% in a remarkably short time.

      Optional configuration: Standard position sensor, temperature and humidity sensor, pressure gauge, flowmeter, optional MFC
      Feature Highlights:

      User-friendly man-machine interface

      Stable system integration

      Stand-alone control board

      High-speed purge

      Compatibility with multiple EAP communications

      Software Description
      TLP Software
      TLP Software
      An intelligent, efficient, stable, and professional host software, coupled with a customized purging strategy and comprehensive status monitoring, ensures the cleanliness and humidity stability within the wafer cassette, thereby preserving the wafer's characteristics and quality.

      Feature Highlights:
      ▪ Supports standard three-stage purging control.
      ▪ With FabScope, it can display the current operational status information of all equipment.
      Important Parameters
      Technical IndicatorsParameters
      Clean Grade≤Class100
      Filtration Precision0.003um
      Power Source220V，50Hz，2A


      BACK